Kryo Anlagenbau, Gas Rückgewinnung und Tieftemperatur Anlagen von Systec GmbH
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GmbH - Gesellschaft für
Laser- und Kryotechnik

Deflash of sealing compound

Often it is a problem to remove sealing compound of electronical components which remains after the production process.

This could be solved easy by Lasers, which can cut quick and very precise excessive sealing from the electronic parts and also from contact surfaces.

The very short impact avoids any change of the metal structure or the electronic circuits itself.

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